I-Laser Degating ye-sprue
Isango lepulasitiki, elaziwa nangokuthi asprue, wuhlobo lwephinikhodi yomhlahlandlela esele enqubweni yokubumba umjovo. Yingxenye ephakathi kwesikhunta kanye nomgijimi womkhiqizo. Ukwengeza, kokubili i-sprue kanye nomgijimi kubizwa ngokuthi isango ngokuhlangene. Impahla eyeqile lapho kuhlangana khona isango kanye nesikhunta (esaziwa nangokuthi i-flash) ayinakugwenywa ngesikhathi sokubunjwa komjovo futhi kufanele isuswe lapho isicutshungulwa. APlastic Sprue Laser Cutting Machineiyidivayisi esebenzisa amazinga okushisa aphezulu akhiqizwa ama-lasers ukuze ancibilikise isango kanye ne-flash.
Okokuqala, ake sikhulume ngepulasitiki yokusika i-laser. Kunezindlela ezahlukahlukene zokusika i-laser, ngayinye yakhelwe ukusika izinto ezahlukahlukene. Namuhla, ake sihlole ukuthi ama-laser asetshenziswa kanjani ukusika ipulasitiki, ikakhulukazi i-mold sprue. Ukusika i-laser kusebenzisa i-laser enamandla amakhulu ukushisa into engaphezu kwendawo yayo yokuncibilika, bese i-material ihlukaniswa ngosizo lokugeleza komoya. Ukusika i-laser ekucubunguleni ipulasitiki kunikeza izinzuzo eziningi:
1. Ukulawula okuhlakaniphile nokuzenzakalelayo: Ukusika i-laser kuvumela ukuma okunembile kanye nokwakheka kwesinyathelo esisodwa, okuholela emaphethelweni abushelelezi. Uma kuqhathaniswa namasu esintu, ithuthukisa ukubukeka, ukusebenza kahle, nokonga okuphathekayo kwemikhiqizo.
2. Inqubo yokungaxhumani nabo:Ngesikhathi sokusika nokuqoshwa kwe-laser, i-laser beam ayithinti indawo engaphezulu, iqinisekisa ikhwalithi yomkhiqizo engaguquki futhi ithuthukisa ukuncintisana kwamabhizinisi.
3. Indawo encane ethinteke ukushisa:I-laser beam inobubanzi obuncane, okwenza kube nomthelela omncane wokushisa endaweni ezungezile ngesikhathi sokusika, ukunciphisa ukuguqulwa kwezinto kanye nokuncibilika.
Kubalulekile ukuqaphela ukuthi izinhlobo ezahlukene zepulasitiki zingaphendula ngendlela ehlukile kumalaser. Amanye amapulasitiki angase asikwe kalula ngamalaser, kuyilapho amanye angase adinge amaza amaza e-laser athile noma amazinga wamandla ukuze asike ngempumelelo. Ngakho-ke, lapho ukhetha ukusikwa kwe-laser kwepulasitiki, kuhle ukwenza ukuhlolwa nokulungiswa okusekelwe ohlotsheni oluthile lwepulasitiki kanye nezidingo.
Indlela yokusika i-sprue yepulasitiki?
Ukusika i-laser sprue laser kuhlanganisa ukusebenzisa imishini yokusika i-CO2 laser ukususa imiphetho eyinsalela namakhona epulasitiki, ngaleyo ndlela kuzuzwe ubuqotho bomkhiqizo. Umgomo wokusika i-laser ukugxilisa i-laser beam endaweni encane, okudala ukuminyana kwamandla aphezulu endaweni okugxilwe kuyo. Lokhu kubangela ukwanda okusheshayo kwezinga lokushisa endaweni ye-laser irradiation, ngokushesha kufinyelele izinga lokushisa lokuhwamuka bese kwakheka imbobo. Inqubo yokusika i-laser bese ihambisa i-laser beam ngokuhlobene nesango ngendlela enqunywe kusengaphambili, yenza ukusika.
Unentshisekelo ye-laser cutting plastic sprue(i-laser degating), into egobile ye-laser?
Xhumana nathi ukuze uthole izeluleko eziningi ze-laser!
Kunconyiwe Laser Cutter for Plastic
Yiziphi izinzuzo zokucubungula zokusika i-plastic sprue laser?
Ukuze uthole imibhobho yokubumba yomjovo, ubukhulu obunembile kanye nokwakheka kubalulekile ukuze kuqinisekiswe ukugeleza okunembile kwe-resin nekhwalithi yomkhiqizo. Ukusika i-laser kungasika ngokunembile umumo oyifunayo we-nozzle ukuze uhlangabezane nezidingo zokuklama. Izindlela zendabuko ezifana nokugunda ngogesi ziyehluleka ukuqinisekisa ukusika okunembile kanye nokuntuleka kokusebenza kahle. Nokho, imishini yokusika i-laser ibhekana ngokuphumelelayo nalezi zinkinga.
Ukusika kwe-vaporization:
I-laser beam egxilile ishisa indawo ebonakalayo ifike endaweni ebilayo, yenze imbobo kakhiye. Ukwenyuka kokumuncwa ngenxa yokuvalelwa kuholela ekujuleni ngokushesha komgodi. Njengoba imbobo ijula, umhwamuko okhiqizwa phakathi nokubilisa uguguleka udonga oluncibilikisiwe, ufutha njengenkungu futhi ukhulise imbobo. Le ndlela ivame ukusetshenziselwa ukusika izinto ezingancibiliki njengokhuni, ikhabhoni, namapulasitiki e-thermosetting.
Ukuncibilika:
Ukuncibilika kuhilela ukushisisa okokusebenza kuze kufike lapho kuncibilika khona bese kusetshenziswa amajethi egesi ukuphephula into encibilikisiwe, ukugwema ukukhuphuka kwezinga lokushisa okwengeziwe. Le ndlela ngokuvamile isetshenziselwa ukusika izinsimbi.
I-Thermal Stress Fracturing:
Izinto ze-Brittle zizwela ikakhulukazi ekuqhekekeni okushisayo, okubonakala ngokuqhekeka kokucindezeleka okushisayo. Ukukhanya okugxilile kubangela ukushisa kwendawo kanye nokwanda kokushisa, okuholela ekwakhekeni kokuqhekeka, okulandelwa ukuqondisa ukuqhekeka kwezinto. I-crack isakazeka ngesivinini samamitha ngomzuzwana. Le ndlela ivame ukusetshenziselwa ukusika ingilazi.
I-Silicon Wafer Stealth Dicing:
Inqubo ebizwa ngokuthi i-stealth dicing process isebenzisa amadivaysi e-semiconductor ukuze ahlukanise ama-microelectronic chips kumawafa e-silicon. Isebenzisa i-pulsed Nd: laser ye-YAG enobude begagasi obungama-nanometers angu-1064, obufana ne-electronic bandgap ye-silicon (1.11 electron volts noma 1117 nanometers).
Ukusika Okusebenzayo:
Okwaziwa nangokuthi ukusika ilangabi noma ukusika kwe-laser okusizwa ukusha, imisebenzi yokusika esebenzayo njengokusika i-oxy-fuel, kodwa i-laser beam isebenza njengomthombo wokuthungela. Le ndlela ifanele ukusika i-carbon steel enogqinsi olungaphezu kuka-1 mm. Ivumela amandla e-laser aphansi uma usika amapuleti ensimbi awugqinsi.
Singobani?
I-MimoWork iyibhizinisi lobuchwepheshe obuphezulu eligxile ekuthuthukisweni kwezicelo zobuchwepheshe be-laser ezinembayo. Isungulwe ngo-2003, inkampani ihlezi izibeke njengenketho ekhethwayo kumakhasimende emkhakheni wokukhiqiza i-laser emhlabeni jikelele. Ngesu lokuthuthukisa eligxile ekuhlangabezaneni nezidingo zemakethe, i-MimoWork izinikele ocwaningweni, ekukhiqizweni, ekuthengisweni, nasensizakalweni yemishini ye-laser enembayo ephezulu. Baqhubeka nokusungula emikhakheni yokusika i-laser, ukushisela, nokumaka, phakathi kwezinye izinhlelo zokusebenza ze-laser.
I-MimoWork ithuthukise ngempumelelo uchungechunge lwemikhiqizo ehamba phambili, okuhlanganisa imishini yokusika i-laser enembayo ephezulu, imishini yokumaka nge-laser, nemishini yokushisela i-laser. Le mishini yokucubungula i-laser enembayo isetshenziswa kabanzi ezimbonini ezahlukahlukene ezinjengobucwebe bensimbi engagqwali, imisebenzi yezandla, ubucwebe begolide elimsulwa nesiliva, izinto zikagesi, izinto zikagesi, izinsimbi, ihadiwe, izingxenye zezimoto, ukukhiqiza isikhunta, ukuhlanza, namapulasitiki. Njengebhizinisi lesimanje nelithuthukile lobuchwepheshe obuphezulu, i-MimoWork inokuhlangenwe nakho okubanzi ekuhlanganiseni kokukhiqiza okuhlakaniphile kanye namakhono athuthukile ocwaningo nentuthuko.
Izixhumanisi Ezihlobene
Umsiki we-laser usike kanjani ipulasitiki? Indlela yokusika i-plastic sprue nge-laser?
Chofoza lapha ukuze uthole umhlahlandlela we-laser onemininingwane!
Isikhathi sokuthumela: Jun-21-2023